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Your search returned 17 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2002 Volume number : 25 Issue: 01 |
Fabrication Of High Current And Low Profile Micromachined Inductor With Laminated Ni/Fe Core
(Article)
Subject:
Eddy Current
,
Saturation
,
Micromachining
Author:
Jin Wook
Park
Yeun-Ho
Joung
page:
106
-
111
Power And Life Extension Of Battery Ultracapacitor Hybrids
(Article)
Subject:
Battery Life
,
Optimization Algorithm
,
Life-Cycle
Author:
R. A.
Dougal
Shengyi
Liu
page:
120
-
131
Development Of Environmental Friendly Non-Anhydride No-Flow Underfills
(Article)
Subject:
Epoxy
,
Thermal Shock
,
Material Properties
Author:
Zhuquing
Zhang
page:
140
-
147
Development Of Reworkable Underfill From Hybrid Composite Of Free Radical Polymerization System
(Article)
Subject:
Adhesion
,
Epoxy Resin
,
Free Redox Flow Cell
,
Underfill
Author:
Lianhua
Fan
C. P.
Wong
page:
148
-
155
Cylindrical Pin-Fin Fan-Sink Heat Transfer And Pressure Drop Correlations
(Article)
Subject:
Cooling Of Electronic Equipment
,
Forced Convection Heat Transfer
,
Measurement And Data Processing
Author:
Ming
Zheng
R. A
Wirtz
page:
15
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22
Single Chamber Compact Two-Phase Heat Spreaders With Microfabricated Boiling Enhancement Structures
(Article)
Subject:
Boiling
,
Heat Spreading
,
Phase Change
Author:
Sunil S.
Murthy
Yogendra K.
Joshi
Wataru
Nakayama
page:
156
-
163
A Constitutive Model For A High Lead Solder
(Article)
Subject:
Constitutive Modelling
,
Material Properties
,
Plasticity
Author:
Shengmin
Wen
Leon M.
Keer
page:
23
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31
Effects Of Build-Up Printed Circuit Board Thickness On The Solder Joint Reliability Of A Wafer Level Chip Scale Package (Wlcsp)
(Article)
Subject:
Creep Of Solsers
,
Flip Chip
,
Solder Joint Reliability
Author:
John H.
Lau
S-W Ricky
Lee
page:
3
-
14
A Comparison Of The Theory Of Moisture Diffusion In Plastic Encapsulated Microelectronics With Moisture Sensor Chip And Weight- Gain Measurements
(Article)
Subject:
Capacitance Cell
,
Plastic Analysis
,
Moisture Sesation
Author:
Haleh
Ardebili
Lauren R.
Millman
Dave
Peterson
page:
32
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139
99838
(Article)
Subject:
Author:
page:
32
-
37
Squeegee Bump Technologt
(Article)
Subject:
Bump-Slot
,
Flip Chip
,
Interconnect
Author:
Jong-Kai
Lin
Treliant
Fang
page:
38
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44
Effective Elastic Modulus Of Underfill Material For Flip-Chip Applications
(Article)
Subject:
Effective Width
,
Flip-Chip
,
Micromechanics
,
Underfill
Author:
Jianmin
Qu
C. P.
Wong
page:
53
-
65
Humidity Management Of Outdoor Electronic Equipment Methods Pitfalls, And Recommendations
(Article)
Subject:
Absolute Measurement
,
Surface Reactivity
,
Weathering
Author:
Michal
Tencer
S.
Moss
page:
66
-
72
Reliability Of Plastic Ball Grid Array Package
(Article)
Subject:
Delamination
,
Moisture Absorbent
,
Soldering Error
Author:
Yuko
Sawada
Seiji
Oka
Akihiko
Yamaguchi
page:
73
-
77
Characterization Of Compact Heat Sink Models In Natural Convection
(Article)
Subject:
Compact Heat Exchanger
,
Effective Ductility
,
Fluid Flow
Author:
Susheela
Narasimhan
Joseph
Majdalani
page:
78
-
86
Electroless Nickel Bumping Of Aluminum Bondpads Part I Surface Pretreatment And Activation
(Article)
Subject:
Electroless Nickel Plating
,
Flip-Chip
,
Bump Characterization
Author:
David A.
Hutt
Changqing
Liu
Samjid H.
Mannan
page:
87
-
97
Electroess Nickel Bumping Of Aluminum Bondpads Part Ii Electroless Nickel Olating
(Article)
Subject:
Electroless Nickel Plating
,
Wafer
,
Flip-Chip
Author:
David A.
Hutt
Changqing
Liu
David B.
Whalley
page:
98
-
105
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